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Thông tin chi tiết sản phẩm:
Thanh toán:
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| Tên sản phẩm: | 8,5W/mK Nhiệt độ cao 0,5mm Silicone Gap Filler Filler Poods cho GPU CPU LED | Từ khóa: | Miếng đệm nhiệt silicon |
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| Continuos sử dụng temp: | -40 đến 200 | Tỉ trọng: | 3,5g/cc |
| Độ cứng: | 10 bờ 00 | Màu sắc: | Xám |
| Độ dẫn nhiệt & tổng hợp: | 8,5W/mk | Độ dày: | 0,04 ~ 0,12 inch / 1.0 ~ 3.0mmt |
| Sự thi công: | Chất đàn hồi silicon đầy gốm | Ứng dụng: | GPU CPU dẫn đầu |
| Làm nổi bật: | 8.5W/mK silicone thermal pads,GPU CPU thermal gap filler,LED thermal pads -40℃ to 200℃ |
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| Attribute | Value |
|---|---|
| Products name | 8.5W/MK High Temperature 0.5mm Custom Silicone Gap Filler Electric Thermal Pads For Gpu Cpu Led |
| Keywords | Silicone Thermal Pads |
| Continuous Use Temp | -40℃ to 200℃ |
| Density | 3.5g/cc |
| Hardness | 10 Shore 00 |
| Color | Gray |
| Thermal conductivity & Composition | 8.5W/m-K |
| Thickness | 0.04~0.12inch / 1.0~3.0mmT |
| Construction | Ceramic filled silicone elastomer |
| Application | Gpu Cpu Led |
TIF ®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.
| Property | Value | Test method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ******* |
| Density | 3.5g/cc | ASTM D792 |
| Thickness range | 0.04~0.12inch / 1.0~3.0mm | ASTM D374 |
| Hardness | 10 Shore 00 | ASTM 2240 |
| Breakdown Voltage(V/mm) | ≥5000 | ASTM D149 |
| Recommended Operating Temp | -40 ~200℃ | Ziitek Test Method |
| Dielectric Constant @1MHz | 6.7 | ASTM D150 |
| Volume Resistivity | ≥1.0X1012Ohm-meter | ASTM D257 |
| Fire rating | V-0 | UL94 (E331100) |
| Thermal conductivity | 8.5W/mK | ASTM D5470 |
Standard Thickness: 0.04" to 0.12" (1.0 to 3.00 mm) with increments of 0.01 (0.25 mm).
Standard Size: 16"X16"(406 mm×406 mm).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
The packaging of thermal pad:
Lead Time: Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Independent R&D team
Người liên hệ: Dana Dai
Tel: 18153789196
