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| Products name: | High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element | Keywords: | Thermal Silicone Pad |
|---|---|---|---|
| Hardness: | 75 Shore 00 | Application: | CPU GPU PC Motherboard |
| Color: | Gray | Thermal conductivity& Compostion: | 3.5W/m-K |
| Density: | 3.0g/cc | Thickness: | 0.02~0.20inch / 0.5~5.0mmT |
| Construction: | Ceramic filled silicone elastomer | Continuos Use Temp: | -40℃ to 200℃ |
High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
TIF100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIF®100-35-11UF Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ******* |
| Density | 3.0g/cc | ASTM D297 |
| Thickness range | 0.02~0.20inch / 0.5~5.0mmT | ASTM C351 |
| Hardness | 75 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temp | -40 ~200℃ | ******* |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 3.5W/mK | ASTM D5470 |
Product Specifications
Standard Thickness:
0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
8"X16"(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Người liên hệ: Dana Dai
Tel: 18153789196
