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| Product name: | Blue 4.0W Thermally Conductive Gel Thermal Gap Filler For Micro Heat Pipe | Density: | 2.5g/cc |
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| Color: | Blue | Recommended Operating Temp(℃）: | -45-200 ℃ |
| Thermal conductivity: | 4.0W/mK | Keywords: | Thermal gel |
| Bond Line Thickness: | 0.20mm | Shelf Life: | 12 months |
| Construction & Composition: | Ceramic filled silicon material | ||
| Làm nổi bật: | blue thermal conductive gel,4.0W/mK heat pipe gel,micro heat pipe thermal gel |
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Blue 4.0W Thermally Conductive Gel Thermal Gap Filler For Micro Heat Pipe
Product description
TIF®040-12 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®040-12 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.
Feature
>Thermal conductivity: 4.0 W/mK
>Soft, very low compression
>Low thermal impedance
>Operate automatically
>Proven long-term reliability
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controller
>Telecom industry
>Semiconductor automatic laboratory equipment
>CPU
>Display card
>Mainboard/mother board
>Notebook
| TIF®040-12 Typical Properties | ||
| Property | Value | Test method |
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicon material | - |
| Flow Rate(g/min) | 60 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
| Density(g/cc) | 2.50g/c | ASTM D297 |
| Thermal conductivity | 4.0W/mK | ASTM D5470 |
| Thermal Impedance @10psi (℃.in²w) | 0.093 | ASTM D5470 |
| Thermal Impedance @50psi (℃.in²w) | 0.086 | ASTM D5470 |
| Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
| Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness(mm) | 0.20 | Ziitek Test Mothod |
| Flame Rating | V-0 | UL 94 |
| Shelf Life | 12 months | - |
Product Specification:
30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
FAQ:
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Người liên hệ: Dana Dai
Tel: 18153789196
