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High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards

Trung Quốc Dongguan Ziitek Electronic Materials & Technology Ltd. Chứng chỉ
Trung Quốc Dongguan Ziitek Electronic Materials & Technology Ltd. Chứng chỉ
Pad dẫn nhiệt là tìm kiếm và làm việc rất tốt. Chúng tôi không cần phải có Pad dẫn nhiệt khác ngay bây giờ!

—— Peter Goolsby

Tôi đã hợp tác với Ziitek trong 2 năm, họ cung cấp vật liệu dẫn nhiệt chất lượng cao, và giao hàng kịp thời, đề nghị vật liệu thay đổi giai đoạn của họ

—— Antonello Sau

Chất lượng tốt, dịch vụ tốt. Nhóm của bạn luôn luôn giúp chúng tôi và giải quyết, hy vọng chúng tôi sẽ là đối tác tốt mọi lúc!

—— Chris Rogers

Tôi trò chuyện trực tuyến bây giờ

High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards

High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards

Hình ảnh lớn :  High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards

Thông tin chi tiết sản phẩm:
Place of Origin: China
Hàng hiệu: ZIITEK
Chứng nhận: UL and RoHs
Model Number: TIF100-12-66U
Thanh toán:
Minimum Order Quantity: 1000pcs
Giá bán: Có thể đàm phán
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Chi tiết sản phẩm
Products name: High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules Continuos Use Temp: -40℃ to 160℃
Application: Mainboard/Mother Boa/Memory Modules Cooling Density: 2.1g/cc
Hardness: 27±5 Shore 00 Color: Green
Thermal conductivity& Compostion: 1.2W/m-K Thickness: 0.010~0.20inch / 0.25~5.0mmT
Construction: Ceramic filled silicone elastomer Keywords: Thermal Conductive Silicone Pad
Làm nổi bật:

high temperature resistant thermal pad

,

motherboard heatsink cooling pad

,

thermal conductive silicone pad

High Temperature Resistant Heatsink Cooling Gap Filler Pad Thermal Conductive Silicone Pad For Mainboard/Mother Boa/Memory Modules

 

Product description

 

TIF100-12-66U Series thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0.

 

Features

 

> Excellent thermal conductivity: 1.2W/mK

> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

 

Applications

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

 

Typical Properties of TIF100-12-66U Series
Property Value Test method
Color Green Visual
Construction &Compostion Ceramic filled silicone elastomer *****
Thickness range

0.010"(0.25mm)~0.200"(5.0mm)

ASTM D374
Specific Gravity 2.1 g/cc ASTM D297
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ *****
Dielectric Breakdown Voltage(T-1.0mm) >5500 VAC ASTM D149
Dielectric Constant @ 1MHz 4.0 ASTM D150
Volume Resistivity 1.0x1012 Ohm-meter ASTM D257
Flame rating 94-V0 UL E331100
Thermal conductivity 1.2 W/m-K ASTM D5470

 

Product Specification


Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Safe disposal method does not require special protection.The storage condition is low temperature and dry,

away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

High Temp Thermal Conductive Silicone Pad 1.2W/m-K for Motherboards 1

Chi tiết liên lạc
Dongguan Ziitek Electronic Materials & Technology Ltd.

Người liên hệ: Dana Dai

Tel: 18153789196

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