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Thông tin chi tiết sản phẩm:
Thanh toán:
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| Tên sản phẩm cùng loại: | Vật liệu đệm khoảng cách bằng silicone Vật liệu GAP PAD nhiệt mềm cho bộ xử lý AI Máy chủ AI Viễn th | Ứng dụng: | Bộ xử lý AI, Máy chủ AI, Nhà thông minh, Viễn thông |
|---|---|---|---|
| Nhiệt độ hoạt động đề xuất: | -40 đến 200℃ | Độ dẫn nhiệt: | 5.0W/m-K |
| độ cứng: | 65/20 Bờ 00 | Tỉ trọng: | 3,2g/cm³ |
| Màu sắc: | màu xám đen | độ dày: | 0,010 "(0,25mm) ~ 0,200" (5,0mm) |
| Từ khóa: | đệm khe hở nhiệt |
Silicone-Based Gap Pad Filler Soft Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom
The TIF®100-50-11US Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines higt thermal conductivity with a near-fluid ultimate softness, ensuring perfect filing of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance, and providing superior thermal solutions and physical protection for the most precise and higt heat flux electronic components.
Features
> Good thermal conductive: 5.0W/mK
> Moldability for complex parts
> Easy release construction
> Electrically isolating
> High durability
Applications
Electronic Components – 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robotics, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®100-50-11US Series | |||
| Property | Value | Test method | |
| Color | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.2 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 20 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @ 1MHz | 6.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 5.0W/m-K | ASTM D5470 | |
| 5.0W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is availablein custom shapes and various forms.
For other thicknesses or more information, please contact us.
Company profile
Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:
All products are compliant with UL94 V-0, SGS and ROHS standards.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
Người liên hệ: Dana Dai
Tel: 18153789196
